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XPC Copper Clad Laminate
  • XPC Copper Clad Laminate
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    XPC copper clad laminate:

     

    It is a kind of copper foil covered laminated board formed through heat pressing after the electric industry alkali-free glass fiber dips into thermoset epoxy resins and is covered with copper foil at one side or both sides, called copper-clad laminate(CCL) .It is used for production of printed circuit board(PCB).

     

     

    Material

     Phenolic paper 
    Sheet thickness 0.8-1.6mm
    Color Yellow
    Flammability HB
    CTI Value 150V
    Size 40" x 40"(1020x1020mm), 40" x 48"(1020x1220mm), as requested.
    Copper thickness 0.5oz(18μm), 1oz(35μm), 2oz(70μm), as requested.
    Features Low cost but with wide range of application, warpage and twist are small and stable,  suitable for punching at 40~70℃.

    Applications

     Usually used in PCB of computers, home electric appliances etc.


    The last one:G10 epoxy glassfiber sheet
    The last one:FR-4 Copper Clad Laminate

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